This publication, "Technical Terms of Soldering", primarily in addressing electronic engineers and technicians involved in the Surface Mount Technology (SMT). Its main objective is to offer a rough-and-ready overview of the various phenomena that occur during soldering as well as to highlight possible problem areas within the current and future technical development of soldering. My sincere thanks go to President Mr. Makoto Sawamura as well as to his employees of the R&D Department of the Nihon Almit Co. Ltd.