Expert reports

IPC is a global trade association dedicated to the competitive excellence and fi nancial success of its member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly.

With an increase in thickness of the iron layer we achieve a reduction in the thermal transfer behaviour at the same time. With an attempt to compensate this by increasing temperature the situation would be signifi cantly worsened.

The simple solution for pore reduction in soldering points In the course of production of increasingly more complex and efficient electronics, such as for example new hybrid components for the automotive sector, low-porosity solder points are required that cannot be produced with conventional reflow technology.