Do you think that soldering defects cannot be prevented in the SMT-process? This is just not true. Discover the GT solder paste. It guarantees optimum wetting on the most widely varied surface materials and keep high yield by minimising soldering defects.
Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de!
Amongst other materials suitable for copper, nickel, brass and phosphor-bronze RoHS compliant
Optimum wetting Very wide range of applications Designed for PIP/THR Very good printing even on the smallest structures
This advantage can be seen in the following videos:
This video proves the high quality of our GT soldering paste. The paste is all gathered and there is no remaining solder powder at all.
This video shows the outstanding wetting performance while 0.15mm off set print of out GT solder paste (especially with low-silver alloy).
Another good example of the outstanding quality of your GT soldering paste is the comparison to a compatible paste of a competitor. The following videos show our GT soldering paste while printing in THR application. In comparison to the competitors paste, our GT-soldering paste can even be used without Pre-Forms:
Almit GT-soldering paste
No dripping solder balls during pre heat
GT soldering paste wets up very quickly
Competitors paste
Heavy dripping paste during pre heat
Compeitors paste not wetting up at all
Unterer Hammer 3
DE 64720 Michelstadt,
Germany.
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Fr: 08-12 h. 13-15:45 h
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