The solder wire innovation DB-1 RMA LFM-48 reaches a new dimension of wettability with its dual boost. With the combination of a fast and a persistent activator, this wire offers an optimal soldering result. In this way, you achieve a reduction in process time and a long-term reduction in manufacturing costs, even for oxidized components. The innovative microalloying almost completely prevents oxidation of the soldering tip and also enables enormous cost savings in this way by reducing soldering tip consumption and labor costs.
Dual activator SAC alloy Microalloy gentle on soldering tips ROL1 flux classification RoHS-compliant
Uniquely fast wetting behavior Shortened process time Long-term reduction of manufacturing costs Significantly less flux splashes Reduction of soldering tip consumption
Unterer Hammer 3
DE 64720 Michelstadt,
Germany.
Mo-Th: 08-12 h. 13-17 h
Fr: 08-12 h. 13-15:45 h
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