Top Sellers

The best of two worlds

Despite its L0 classification, our halogen-free solder wire SRS-ZL has the properties of an L1 wire. This wire is particularly suitable for automotive applications and impresses with its exceptionally fast wetting behaviour and very good flow properties.

Dual boost for wetting

The solder wire innovation DB-1 RMA LFM-48 reaches a new dimension of wettability with its dual boost. With the combination of a fast and a persistent activator, this wire offers an optimal soldering result. In this way, you achieve a reduction in process time and a long-term reduction in manufacturing costs, even for oxidized components. The innovative microalloying almost completely prevents oxidation of the soldering tip and also enables enormous cost savings in this way by reducing soldering tip consumption and labor costs.

The best protection against copper migration

Discover the Almit solders specially developed for soldering with copper, which effectively reduce leaching. The alloys specially developed to prevent copper migration are suitable for a wide range of applications and are available as solder wire, solid wire and solder bars.

Top sellers for good reasons
No detaching, no cracking and only minimal flux splashes - our GUMMIX series is second to none.

Due to their almost completely splash-free behaviour, the solder wires of the GUMMIX series are particularly suitable for contactless soldering applications, such as laser, induction, wave soldering and xenon lamp, but also for robot soldering and piston soldering.

5x longer soldering tip holding time
The high-performance alloy without silver - LFM-23 S convinces with the best properties of a SnCuNi alloy. High quality, reliable and cost-effective. With a decisive plus: An innovative iron/gallium compound in LFM-23 S reduces oxidation and minimizes iron erosion on the soldering tip. The soldering tip life is increased up to five times and thus helps to reduce production costs.

small area ratio, big performance
The constantly increasing miniaturization poses completely new challenges for industrial production. In order to meet these at eye level, we are developing new generations of soldering and fluxing agents in our Almit research centres. MR-NH is an innovative high-performance solder paste with an outstanding performance that opens up new dimensions in SMT production and stencil printing. Even in applications with an area ratio of less than 0.6, MR-NH convinces with perfect release properties, so that a step stencil is not required for a high component mix.

Long-term reliability in any form
The solder wires and solder pastes of the SJM series are the result of extensive development work by Almit research. The SJM series sets new standards in the strength of lead-free solder wire, which previously could only be achieved by using leaded solder wire. With five different alloys with different filler metals, there is a suitable solder wire or solder paste for every specific application.

The life insurance for soldering tips
There is no remedy against the erosion of the soldering tip anyway, that's what it was thought until now. It's time to rethink. The patented S-Line has successfully proven that the use of the correct alloy can greatly minimize soldering tip erosion and thus significantly extend the life of a soldering tip. What is true for the S-line and erosion is even more true for the new M-line in terms of oxidation. This is because the new M-Line can not only reduce oxidation, but almost completely prevent it.

Perfect performance for the SMT-process
Do you think that soldering defects cannot be prevented in the SMT-process? This is just not true. Discover the GT solder paste. It guarantees optimum wetting on the most widely varied surface materials and keep high yield by minimising soldering defects.