SJM-03 NH(EB) |
Sn0.3Ag0.7Cu2.0Bi0.01Fe |
- Fusion point 210-225°C
- 100% halide-free
- Improve continuous printing & stable deposit
- Upgrade wetting of fine powder
- Minimize solder ball
- Flux agent L0 classified
- Available in particle size 4,5
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LFM 48 TM-HP |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Outstanding print result
- A very high pre-heating temperature of up to 200°C is possible
- In compliance with AQP requirements
- Very good wetting properties
- Flux agent L1 classified
- Available in particle size 3,4,5
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LFM 48 TM-HP(K) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 TM-HP(L) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Excellent form-retaining properties on the stencil plate
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 TM-HP(M) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Highly activated flux agent
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 TM-HP(P) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Highly activated flux agent
- Suitable for wetting-resistant material
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 TM-HP(S) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- High-velocity printing
- Possible print speeds of up to 125mm/s
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 TM-HP(Y) |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Good wetting properties
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48 MHS30 |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Flux agent L0 classified
- Available in particle size 3,4
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LFM48 SSIM |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Developed for Spot-Reflow applications
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 48N FS |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Flux agent L1 classified
- Available in particle size 6
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LFM 48 PMK |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- Flux agent L1 classified
- Available in particle size 3,4
|
LFM 48 GUMMIX |
Sn3.0Ag0.5Cu |
- Fusion point 217-220°C
- No flux agent "spit back"
- No need for flux residue removal after soldering
- Flux agent L1 classified
- Available in particle size 3,4
- Available as of January 2008
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LFM 31 MHS32 |
Sn3.0Bi8.0Zn |
- Fusion point 190-199°C
- Low melting solder paste
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 34 TM-HP |
Sn3.5Ag |
- Fusion point 221°C
- Outstanding print result
- Eutektik Solder
- A very high pre-heating temperature of up to 200°C is possible
- Very good wetting properties
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 52 IBL |
Sn3.5Ag0.5Bi3.0In |
- Fusion point 207-214°C
- Low melting solder paste
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 57 TM-HP |
Sn5.0Sb |
- Fusion point 235-240°C
- High-temperature solder
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 65 A75C |
Sn58.0Bi |
- Fusion point 139°C
- Low melting solder paste
- Eutektik Solder
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 14 TM-HP |
Sn3.5Ag0.7Cu |
- Fusion point 217-218°C
- Outstanding print result
- A very high pre-heating temperature of up to 200°C is possible
- Very good wetting properties
- Flux agent L1 classified
- Available in particle size 3,4
|
LFM 14 TM-HP(L) |
Sn3.5Ag0.7Cu |
- Fusion point 217-218°C
- Excellent form-retaining properties on the stencil plate
- Flux agent L1 classified
- Available in particle size 3,4,5
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LFM 14 MHS30 |
Sn3.5Ag0.7Cu |
- Fusion point 217-218°C
- Flux agent L0 classified
- Available in particle size 3,4
|
LFM 70 INP |
Sn3.5Ag0.5Bi8.0In |
- Fusion point 194-206°C
- Low melting solder paste
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 71 IBL |
Sn3.5Ag0.5Bi4.0In |
- Fusion point 205-212°C
- Low melting solder paste
- Flux agent L1 classified
- Available in particle size 3,4
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LFM 82 TM-HP |
Sn3.9Ag0.6Cu |
- Fusion point 217-218°C
- Outstanding print result
- A very high pre-heating temperature of up to 200°C is possible
- Very good wetting properties
- Flux agent L1 classified
- Available in particle size 3,4
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