Soldering terminology

In this method, as the figure shows, the molten solder is blown at a flow rate of 2 m/s on the circuit board. Here, the Bernoulli effect of flowing liquids is used, i.e. the higher the flow rate, the lower the pressure on outwardly curved surfaces or on the outer surface of the solder flow. Therefore, the solder can cover the whole area of the part . Moreover, because a uniform and rapid solder flow is added to scrubbing effect , the fluxing agent can be better removed with gas emerging from the jet. As illustrated, a cavity is formed under the solder wave which gives the name of this method (hollow-shaft soldering).