Solderpaste for micro-dispensing applications Perfect control of the production process, very good wetting properties, homogeneous dispensing results. Based on our long market experience with selective soldering applications our LFM 89 NH-MDL solder paste provides reliable solder joints even under high temperature gradients especially on laser robot applications. Leadfree solder paste. 20 - 38µm, Sn-58Bi-0.4Ag, 139°C-168°C, Flux 12%, ROLO, No clean.
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