If you want to have a great future, you have to be better than others. This is also the case with our L1 Laser Dispensing Paste SSI-M. It was specially developed for contactless soldering and impresses with the best properties, such as stable dispensing characteristics and easy control of the solder paste quantity. It is versatile, can be easily adapted to work processes and always forms a reliable solder joint. In addition, it convinces with excellent melting behavior in the selective soldering process.
The alloy LFM-48 (Sn-3.0Ag-0.5Cu, melting range 217-220°C) is a SAC alloy and is recommended by the Japan Electronics and Information Technology Industries Association (JEITA).
Leadfree solderpaste, 10 - 28µm, Sn-3,0Ag-0,5Cu, 217° - 220°C, Flux 13%, ROL1, No clean
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