You are familiar with the problem of copper migration. But do you also know the best solution? Discover the specially developed alloy LFM-59 from Almit. It is based on a special 2-metal compound with a very high copper content, which limits copper alloying to a minimum. LFM-59 is available as solder bar and as solid wire without flux core and can be used for a wide range of applications where copper alloying is a problem.
Solder bar, Sn-3,0Cu, 217° - 312°C.