Welcome to the whole world of soldering - Welcome to Almit!

GUMMIX-Serie

Top sellers for good reasons
No detaching, no cracking and only minimal flux splashes - our GUMMIX series is second to none.

Due to their almost completely splash-free behaviour, the solder wires of the GUMMIX series are particularly suitable for contactless soldering applications, such as laser, induction, wave soldering and xenon lamp, but also for robot soldering and piston soldering.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 lead-free and leaded Gummix solder wires available
 RoHS compliant

Minimal flux splashes
 Minimum quantity of flux splattering
 No detachment of the flux residues
 No crack formation
 Suitable for flexible boards

LFM-23 S

5x longer soldering tip holding time

The high-performance alloy without silver - LFM-23 S convinces with the best properties of a SnCuNi alloy. High quality, reliable and cost-effective. With a decisive plus: An innovative iron/gallium compound in LFM-23 S reduces oxidation and minimizes iron erosion on the soldering tip. The soldering tip life is increased up to five times and thus helps to reduce production costs.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 Without silver
 With innovative iron/gallium compound
 RoHS compliant

Special advantages
 5x higher soldering tip life
 Little flux splashes
 High material strength

MR-NH

small area ratio, big performance
The constantly increasing miniaturization poses completely new challenges for industrial production. In order to meet these at eye level, we are developing new generations of soldering and fluxing agents in our Almit research centres. MR-NH is an innovative high-performance solder paste with an outstanding performance that opens up new dimensions in SMT production and stencil printing. Even in applications with an area ratio of less than 0.6, MR-NH convinces with perfect release properties, so that a step stencil is not required for a high component mix.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 Area ratio < 0.6
 Powder size 20-38 µm and 10-28 µm
 ROL0 halogen-free

Special advantages
 Excellent print image
 Excellent release properties
 Optimal contour stability
 Applicable with almost all stencils

SJM Series

Long-term reliability in any form
The solder wires and solder pastes of the SJM series are the result of extensive development work by Almit research. The SJM series sets new standards in the strength of lead-free solder wire, which previously could only be achieved by using leaded solder wire. With five different alloys with different filler metals, there is a suitable solder wire or solder paste for every specific application.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 SJM = Strong Joint Metal (alloys with particularly high strength)
 Individual composition for every requirement

Special advantages
 No Cracking
 Perfect strength
 from 0.3% to 4% silver content
 patented alloy
 ideal for through-hole plating

S line + M line

The life insurance for soldering tips
There is no remedy against the erosion of the soldering tip anyway, that's what it was thought until now. It's time to rethink. The patented S-Line has successfully proven that the use of the correct alloy can greatly minimize soldering tip erosion and thus significantly extend the life of a soldering tip. What is true for the S-line and erosion is even more true for the new M-line in terms of oxidation. This is because the new M-Line can not only reduce oxidation, but almost completely prevent it.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 S-Line: Minimization of solder tip erosion
 M-line: Reduction of oxidation
 Individual composition for every requirement

Special advantages
The S line allows for minimizing erosion, the M line prevents oxidation.
The result:
 Reduced soldering tip consumption
 Reduced soldering time and labour costs
 Reduced solder consumption = enormous cost saving

GT-Flux Solder Paste

Perfect performance for the SMT-process
Do you think that soldering defects cannot be prevented in the SMT-process? This is just not true. Discover the GT solder paste. It guarantees optimum wetting on the most widely varied surface materials and keep high yield by minimising soldering defects.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 Amongst other materials suitable for copper, nickel, brass and phosphor-bronze
 RoHS compliant

Special advantages
 Optimum wetting
 Very wide range of applications
 Designed for PIP/THR
 Very good printing even on the smallest structures

SRS-ZL

The best of two worlds
Our halogen-free solder wire SRS-ZL convinces with its exceptionally fast wetting behavior with the properties of an L1 wire.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

Short facts:
 Halogen free
 Available with the alloys LFM-23S and LFM-48M
 RoHS compliant

Special advantages
 Exceptionally fast wetting behavior
 Very good flow behavior
 Particularly well suited for automotive applications