Soldering terminology

Finer grain boundaries automatically lead to small grains or crystallites. This property describes the size of the grain . The smaller the grain size of the alloy after brazing, the higher the strength of the solder joint. Creep resistance is generally proportional to the square root of the grain size. Grain size is dependent on the cooling rate , the degree of deformation , the heating of the metal and other conditions and can be specified by observing the specific grain diameter under the microscope as a relative quantity . See also Creep .