Soldering terminology

A test method that has become quite popular in recent times where a molten solder globule is placed on a surface that does not wet the solder (a plate made from glass or stainless steel ) and a copper wire is lowered horizontally so that it divides the solder globule in two. Wettability is then estimated based on the time required for the solder to enclose the copper wire. Although no quantitative measurement is possible, this method quickly yields qualitative information on wettability.