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Protection against copper leaching
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Solder paste lead free Flux & Alloy
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Solder wire
Solder wire lead free
» LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
DB-ZERO LFM-48M
SRS-ZL LFM-48 S (3.5%)
GUMMIX-19 NH LFM-48-S (3.5%)
DB-1 RMA LFM-48M (3.5%)
GUMMIX-21 Zeta LFM-48-M (3,50%)
QB-1 LFM-48 M 3.5%
SR-LA Super LFM-48-M (3,50%)
SR-37 LFM-48 S (3.50%)
SR-55 LFM-48 S
» LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
SRS-ZL LFM-23 S (3.5%)
NHR-TH LFM-23 S (3.50%)
DB1-RMA LFM-23S 3,5% Flux 3,5%
QB-1 LFM-23S 3.5%
SR-LA SUPER LFM 23-S (3.50%)
» LFM-41 S (Sn-0.3Ag-2.0Cu+α) 217-271°C
SR-37 LFM-41 S (3.50%)
» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
Gummix HF LFM 48
GUMMIX-SB RMA LFM-48 (3.50%)
KR-19 SH RMA LFM-48 (3.50%)
KR-19 LFM-48 (3.50%)
» SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
SRS-RMA-NC SJM-03 S (3.50%)
GUMMIX-21 Zeta SJM-03 S (3.50%)
GUMMIX-21 Zeta SJM-03 S (2.50%)
SR-LA SJM-03-S (3.50%)
Solder wire leaded
» Sn63 (Sn-37.0Pb)
SRC HM1 RMA Sn63 (9.50%)
KR-19 RMA Sn63 (2.20%)
» 60A (Sn-40Pb)
KR-19 60A (2.20%)
KR-19 SH RMA 60A (2.20%)
GUMMIX-SB RMA 60A (2.20%)
» Sn62 (Sn-2.0Ag-36.0Pb)
KR-19 SH RMA Sn62 (2.20%)
» Sn8 (Sn-92Pb)
KR-28 Sn8 (2.20%)
GUMMIX Series
» LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
GUMMIX-21 Zeta LFM 23-S (3.50%)
» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
GUMMIX SB RMA LFM-48 (3.50%)
Gummix HF LFM 48
GUMMIX-19 CH LFM-48 (3.50%)
» LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
GUMMIX-21 Zeta LFM-48-M (3,50%)
GUMMIX-19 NH LFM-48-S (3.5%)
» SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
GUMMIX-21 Zeta SJM-03 S (3.50%)
Accessories
» Desoldering braid
» Tip cleaner
» Flux removers
Flux Classification
Solder paste
Solder paste lead free
» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
LFM-48 MR-NH (for aspect ration < 0,6)
LFM-48W NH-GE
LFM 48 NH(LVA) (LVA=Low Void Additive)
LFM-48 NH IMT (optimized print volume)
LFM-48 GT(R)-SR 12%
LFM-48 FS (for powder size 5.5)
LFM-48 TM-HP (O) (long open time)
» SJM-03 (Sn-0.3Ag-0.7Cu-2.0Bi) 210-226°C
SJM-03 NH IMT (11.50%)
» SJM-40 (Sn-4.0Ag-2.0Bi-3.0Sb) 221-227°C
SJM-40
SJM-40W NH(IMT)
SJM-40W GT(R)-SR 12%
» LFM-65 (Sn-58.0Bi) 139°C
LFM-65W TM-HP(NC)
» LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
LFM-70 INP (11%)
LFM-70 INP (14%)
» LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 194-206°C
LFM-96W INP (11%)
Solder paste leaded
» Sn62 (Sn-2.0Ag-36Pb)
Sn62 SRC HM1 RMA (9.50%)
Sn62 SRC HM1 RMA T3 (9.50%)
Sn62 SRC HM1 RMA (12%)
SRC Sn62U SS4M (15%) Mydata/Micronics Jet Paste
SRC Sn62U SDL Flux 15% Jet Paste
» SJ7 (Sn-34.5Pb-3.0Ag-0.5Sb)
SJ7 HA2-RA (10%)
Dispenser Paste
» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
LFM-48U SDK(NH) 15%.Jet Paste
LFM-48 NH-MDL for very high temperature gradient
LFM-48W NH Dispening paste
LFM-48U MDA-5 (10-28µm) Jet Paste for Mydata/Mycronic
LFM-48U SDK (10-28µm) Jet Paste
LFM-48U MJD Jet Paste
LFM 48 GT Dispensing Paste
LFM-48 SSI-M for very high temperature gradient
» LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
LFM 70 INP Dispenser Paste
» LFM-89 (Sn-58.0Bi-0.4Ag) 139°C-168°C
LFM-89 NH-MDL Micro-Dispensing Lasersoldering
» Sn62 (Sn-2.0Ag-36Pb) 179-190°C
SRC Sn62U SS4M (15%) Mydata/Mycronic Jet Paste
SRC Sn62U SDL Flux 15% Jet Paste
Sn62 SRC HM1 RMA (12%)
Accessories
» Solder paste spatula ESD safe
» Solder paste softener
Flux Classification
Solder bars
Solder bars and solid wire
» LFM-22 H (Sn-0.7Cu)
» LFM-48 H (Sn-3.0Ag-0.5Cu)
» LFM-59 H (Sn 3.0Cu)
» LFM-62 H (Sn-3,0Cu-0,5Ni)
Flux
Flux
» BM-1 RMA
» BM-5000 RMA
» RC-15SH RMA
» RC-281 PF
Applications
Laser soldering
» Solder wire
GUMMIX SB RMA LFM-48 217-220°C
GUMMIX-21 Zeta LFM 23-S (3.50%) 228°C
Gummix HF LFM 48
» Solder Paste
LFM-89 NH-MDL Micro-Dispensing Lasersoldering 139-168°C
Flux Classification
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Deutsch
English
français
Technology
Top Sellers
Contactless soldering
Silver free alloy
Small area-ratio solder paste
Increased solder joint strength
Soldering tip-protecting alloy
Allrounder solder paste
Halogen-free with L1 quality
Dual boost for wetting
Protection against copper leaching
Know-How
Compendium
Expert reports
Expertise
Product flyer
Almit Classifications
Solder wire lead free Flux & Alloy
Solder paste lead free Flux & Alloy
Solder wire leaded flux
Solder paste leaded
Solder bars and wires
Flux
Alloy Overview
Alloy Surcharge
PIEK and IPC-Training
Important notice
Shop
Solder wire
Solder wire lead free
LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
DB-ZERO LFM-48M
SRS-ZL LFM-48 S (3.5%)
GUMMIX-19 NH LFM-48-S (3.5%)
DB-1 RMA LFM-48M (3.5%)
GUMMIX-21 Zeta LFM-48-M (3,50%)
QB-1 LFM-48 M 3.5%
SR-LA Super LFM-48-M (3,50%)
SR-37 LFM-48 S (3.50%)
SR-55 LFM-48 S
LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
SRS-ZL LFM-23 S (3.5%)
NHR-TH LFM-23 S (3.50%)
DB1-RMA LFM-23S 3,5% Flux 3,5%
QB-1 LFM-23S 3.5%
SR-LA SUPER LFM 23-S (3.50%)
LFM-41 S (Sn-0.3Ag-2.0Cu+α) 217-271°C
SR-37 LFM-41 S (3.50%)
LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
Gummix HF LFM 48
GUMMIX-SB RMA LFM-48 (3.50%)
KR-19 SH RMA LFM-48 (3.50%)
KR-19 LFM-48 (3.50%)
SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
SRS-RMA-NC SJM-03 S (3.50%)
GUMMIX-21 Zeta SJM-03 S (3.50%)
GUMMIX-21 Zeta SJM-03 S (2.50%)
SR-LA SJM-03-S (3.50%)
Solder wire leaded
Sn63 (Sn-37.0Pb)
SRC HM1 RMA Sn63 (9.50%)
KR-19 RMA Sn63 (2.20%)
60A (Sn-40Pb)
KR-19 60A (2.20%)
KR-19 SH RMA 60A (2.20%)
GUMMIX-SB RMA 60A (2.20%)
Sn62 (Sn-2.0Ag-36.0Pb)
KR-19 SH RMA Sn62 (2.20%)
Sn8 (Sn-92Pb)
KR-28 Sn8 (2.20%)
GUMMIX Series
LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
GUMMIX-21 Zeta LFM 23-S (3.50%)
LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
GUMMIX SB RMA LFM-48 (3.50%)
Gummix HF LFM 48
GUMMIX-19 CH LFM-48 (3.50%)
LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
GUMMIX-21 Zeta LFM-48-M (3,50%)
GUMMIX-19 NH LFM-48-S (3.5%)
SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
GUMMIX-21 Zeta SJM-03 S (3.50%)
Accessories
Desoldering braid
Tip cleaner
Flux removers
Solder paste
Solder paste lead free
LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
LFM-48 MR-NH (for aspect ration < 0,6)
LFM-48W NH-GE
LFM 48 NH(LVA) (LVA=Low Void Additive)
LFM-48 NH IMT (optimized print volume)
LFM-48 GT(R)-SR 12%
LFM-48 FS (for powder size 5.5)
LFM-48 TM-HP (O) (long open time)
SJM-03 (Sn-0.3Ag-0.7Cu-2.0Bi) 210-226°C
SJM-03 NH IMT (11.50%)
SJM-40 (Sn-4.0Ag-2.0Bi-3.0Sb) 221-227°C
SJM-40
SJM-40W NH(IMT)
SJM-40W GT(R)-SR 12%
LFM-65 (Sn-58.0Bi) 139°C
LFM-65W TM-HP(NC)
LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
LFM-70 INP (11%)
LFM-70 INP (14%)
LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 194-206°C
LFM-96W INP (11%)
Solder paste leaded
Sn62 (Sn-2.0Ag-36Pb)
Sn62 SRC HM1 RMA (9.50%)
Sn62 SRC HM1 RMA T3 (9.50%)
Sn62 SRC HM1 RMA (12%)
SRC Sn62U SS4M (15%) Mydata/Micronics Jet Paste
SRC Sn62U SDL Flux 15% Jet Paste
SJ7 (Sn-34.5Pb-3.0Ag-0.5Sb)
SJ7 HA2-RA (10%)
Dispenser Paste
LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
LFM-48U SDK(NH) 15%.Jet Paste
LFM-48 NH-MDL for very high temperature gradient
LFM-48W NH Dispening paste
LFM-48U MDA-5 (10-28µm) Jet Paste for Mydata/Mycronic
LFM-48U SDK (10-28µm) Jet Paste
LFM-48U MJD Jet Paste
LFM 48 GT Dispensing Paste
LFM-48 SSI-M for very high temperature gradient
LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
LFM 70 INP Dispenser Paste
LFM-89 (Sn-58.0Bi-0.4Ag) 139°C-168°C
LFM-89 NH-MDL Micro-Dispensing Lasersoldering
Sn62 (Sn-2.0Ag-36Pb) 179-190°C
SRC Sn62U SS4M (15%) Mydata/Mycronic Jet Paste
SRC Sn62U SDL Flux 15% Jet Paste
Sn62 SRC HM1 RMA (12%)
Accessories
Solder paste spatula ESD safe
Solder paste softener
Solder bars
Solder bars and solid wire
LFM-22 H (Sn-0.7Cu)
LFM-48 H (Sn-3.0Ag-0.5Cu)
LFM-59 H (Sn 3.0Cu)
LFM-62 H (Sn-3,0Cu-0,5Ni)
Flux
Flux
BM-1 RMA
BM-5000 RMA
RC-15SH RMA
RC-281 PF
Applications
Laser soldering
Solder wire
GUMMIX SB RMA LFM-48 217-220°C
GUMMIX-21 Zeta LFM 23-S (3.50%) 228°C
Gummix HF LFM 48
Solder Paste
LFM-89 NH-MDL Micro-Dispensing Lasersoldering 139-168°C
Company
About us
Philosophy
History & Background
Team
International
Environment
Solder Recycling
Sponsoring
Know-How
Compendium
Expert reports
Expertise
Product flyer
Career
Apprenticeship programs
Job opportunities
Ausbildung als Kaufmann
Media / PR
Videos
Press
Gallery
Image brouchure
Customer magazine
User Documents
Contact
Direct contact persons
Almit’s sales agents
Almit’s Distributors
Soldering terminology
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Soldering terminology
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PCB
Paste yield point
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Peltier effect
PCB
Abbreviation for
Printed Circuit Board
. See also
Printed circuit
.
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