Soldering terminology

Name of a chemical nickel plating process (for example with Ni-P) developed by the General American Transportation Co., with wide application including in the plating of connecting wires before soldering. The name is a combination of catalysts, nickel and generation. The chemical components are nickel sulfate, sodium hypophosphite as a reducing agent, alkyl-hydroxyl-carboxylic acid as a complexing agent and other special stabilizers. To adjust the pH according to the conditions of use, NaOH or H2SO4 etc. are added. Electroless nickel plating is also possible by taking advantage of the different ionization tendencies of metals, but this has the disadvantage that the nickel layer is less durable. See also Ionization tendency.